In a patent published last week, Intel reveals how nanotubes' strength and heat-dissipating properties can be used to reinforce the conducting copper tracks that connect millions of transistors together.
Inventor Chi-Won Hwang says depositing heat-sink nanotubes on electrically insulating layers adjacent to the copper tracks slashes the thermal stress caused by fast-pulsing electric currents
June 18, 2007
Intel working on carbon nanotube enhanced chips
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